Cross-section systems and methods
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United States of America Patent
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Feb 26, 2013
Grant Date -
Apr 12, 2012
app pub date -
Jun 16, 2009
filing date -
Jun 20, 2008
priority date (Note) -
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Abstract
A first instrument (230) is used to image a first semiconductor article having a trench (110) of defined cross-section, while a second instrument (220) is used to simultaneously prepare a second semiconductor article with a trench of defined cross-section. Furthermore, a method is disclosed to prepare a trench (110) of defined cross-section in a semiconductor article by rough milling and subsequent fine milling.
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