Molecular bonding method with cleaning with hydrofluoric acid in vapor phase and rinsing with deionized water

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United States of America Patent

PATENT NO 8382933
APP PUB NO 20080196747A1
SERIAL NO

12068638

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Abstract

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Adhesion by molecular bonding of two free surfaces of first and second substrates, for example formed by monocrystalline silicon wafers, comprises at least successively:

    a cleaning step of the two free surfaces with hydrofluoric acid in vapor phase to make the two free surfaces hydrophobic,a rinsing step of said free surfaces with deionized water with a time less than or equal to 30 secondsa step of bringing said free surfaces into contact.

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Patent Owner(s)

Patent OwnerAddress
COMMISSARIAT A L'ENERGIE ATOMIQUE75015 PARIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fournel, Frank Villard-Bonnot, FR 65 226
Morales, Christophe Saint Pierre de Mesage, FR 27 210
Moriceau, Hubert Saint Egreve, FR 93 2315
Perreau, Pierre Grenoble, FR 4 9

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