Process of forming nanocrystal layer
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United States of America Patent
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Feb 26, 2013
Grant Date -
Jun 17, 2010
app pub date -
Nov 10, 2009
filing date -
Jan 21, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A process of forming an ultrafine crystal layer in a workpiece constituted by a metallic material. The process includes: performing a machining operation on a surface of the workpiece, so as to impart a large local strain to the machined surface of the workpiece, where the machining operation causes the machined surface of the workpiece to be subjected to a plastic working that causes to have large local strain in the form of a true strain of at least one, such that the ultrafine crystal layer is formed in a surface layer portion of the workpiece that defines the machined surface of the workpiece. Also disclosed are a nanocrystal layer forming process, a machine component having the ultrafine crystal layer or the nanocrystal layer, and a machine component producing process of producing the machine component.
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