First and second coplanar microstrip lines separated by rows of vias for reducing cross-talk there between
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United States of America Patent
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Feb 19, 2013
Grant Date -
Jul 22, 2010
app pub date -
Jan 29, 2010
filing date -
Jan 16, 2009
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An apparatus for reducing crosstalk including a substrate having a bottom surface and a top surface defining a horizontal plane, a ground plane coupled to the bottom surface of the substrate, first and second microstrip lines formed on the top surface of the substrate, the first and second microstrip lines formed on the top surface of the substrate and spaced apart from one another, and a first plurality of vias traveling through the substrate from the top surface of the substrate to the ground plane and positioned between the first and second microstrip lines for reducing crosstalk between the first and second microstrip lines.
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