Micro electro-mechanical sensor (MEMS) fabricated with ribbon wire bonds
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United States of America Patent
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Feb 19, 2013
Grant Date -
Jan 12, 2012
app pub date -
Sep 19, 2011
filing date -
Mar 24, 2008
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Abstract
A micro electro-mechanical sensor is provided. The micro electro-mechanical sensor includes a substrate, and a conducting plane disposed on the substrate. A conducting via is disposed on the substrate, such as adjacent to the conducting plane. A plurality of ribbon conductors are disposed over the conducting plane and electrically connected to the conducting via, such that the plurality of ribbon conductors form a transducer array in combination with the conducting plane, such as through capacitive coupling that changes in response to changes in the physical shape of the plurality of ribbons.
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