Plasma processing apparatus

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8372239
APP PUB NO 20120325404A1
SERIAL NO

13449304

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Abstract

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An inductively-coupled-plasma (ICP) type plasma processing apparatus is provided. The plasma processing includes an antenna which is substantially straight in a plan view of the antenna. A plasma is generated for performing a plasma treatment to a substrate when a high frequency current is applied to the antenna to form an electric field in a vacuum container. The antenna includes two go-and-return conductors closely disposed to each other in an up-down direction, wherein the up-down direction is perpendicular to a surface of the substrate, and the high frequency current is applied to flow in opposite directions between the two go-and-return conductors. An interval is defined by a distance between the two go-and-return conductors in the up-down direction, varies in a longitudinal direction of the antenna.

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Patent Owner(s)

Patent OwnerAddress
NISSIN ELECTRIC CO LTDKYOTO PREFECTURE KYOTO BEIJING BEIJING TIANJIN TIANJIN MU TING 47 TIMES KYOTO-SHI KYOTO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ando, Yasunori Kyoto, JP 42 399
Matsubara, Yoshio Kyoto, JP 4 374
Tsuji, Masayuki Kyoto, JP 136 895
Tsunoda, Takanori Kyoto, JP 3 17

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