Multi-level interspinous implants and methods of use
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United States of America Patent
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Feb 12, 2013
Grant Date -
Dec 9, 2010
app pub date -
Jun 5, 2009
filing date -
Jun 5, 2009
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Multi-level interspinous implants and methods of using the implants with the implants generally include a first member for placement in a first interspinous space and a second member for placement in a second interspinous space. An elongated connector extends from one of the members and is sized to fit in a slot in the other member. Each of the first and second members may include a distal wing, a body, and a proximal wing. The members may also be positioned in a closed orientation for insertion into the patient and a deployed orientation with the distal and proximal wings extending outward along lateral sides of respective spinous processes. The connector may extend outward from the proximal wing of one of the members and away from the other member when that member is in the closed orientation. The connector may be rotated and inserted into the slot where it is secured when that member from which is extends is moved to the deployed orientation.
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