Intermetal stack for use in a photovoltaic device
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United States of America Patent
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Jan 29, 2013
Grant Date -
Feb 17, 2011
app pub date -
Aug 13, 2009
filing date -
Aug 13, 2009
priority date (Note) -
Expired
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Abstract
A donor silicon wafer may be bonded to a substrate and a lamina cleaved from the donor wafer. A photovoltaic cell may be formed from the lamina bonded to the substrate. An intermetal stack is described that is optimized for use in such a cell. The intermetal stack may include a titanium layer in contact with the lamina, which reacts to form titanium silicide, a non-reactive barrier layer to check the silicide reaction, a low-resistance layer, and an adhesion layer to help adhesion to the receiver element.
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