Die bonding utilizing a patterned adhesion layer
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United States of America Patent
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Jan 29, 2013
Grant Date -
Oct 28, 2010
app pub date -
Apr 5, 2010
filing date -
Apr 3, 2009
priority date (Note) -
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Abstract
An electronic package and method and system for forming the electronic package. The electronic package has a first substrate including a first electronic device and including through-holes extending through an entire thickness of the first substrate. The electronic package has a second substrate bonded to the first substrate, metallizations formed in the through-holes of the first substrate to connect to components of the first electronic device, and a patternable substance disposed between the first substrate and the second substrate and adhering the first substrate and the second substrate together in regions apart from the metallizations. The method and system form through-holes extending through an entire thickness of the first substrate, deposit and pattern an adherable substance on the second substrate in a pattern having openings which expose connections for a second electronic device of the second substrate, align and attach the first substrate and the second substrate together, and form metallizations in the through-holes to connect to the connections for the second electronic device.
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