Copper alloy material and method of making same
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United States of America Patent
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Jan 29, 2013
Grant Date -
Feb 18, 2010
app pub date -
Oct 22, 2009
filing date -
Sep 2, 2005
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Expired
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Abstract
A copper alloy material having: 1.0 to 5.0 mass % of Ni; 0.2 to 1.0 mass % of Si; 1.0 to 5.0 mass % of Zn; 0.1 to 0.5 mass % of Sn; 0.003 to 0.3 mass % of P; and the balance consisting of Cu and an unavoidable impurity. The mass ratio between Ni and each of Si, Zn and Sn is to be Ni/Si=4 to 6, Zn/Ni=0.5 or more, and Sn/Ni=0.05 to 0.2.
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