Substrate pick
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United States of America Patent
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Jan 29, 2013
Grant Date -
Nov 4, 2010
app pub date -
Jul 16, 2010
filing date -
Aug 31, 2006
priority date (Note) -
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status (Latency Note)
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Abstract
Disclosed is a method for handling devices, such as reticles, in a semiconductor manufacturing environment. In one illustrative embodiment, the method includes: providing a pick comprised of a plurality of spaced-apart grippers with a pivot point between the gripper about which point the spaced-apart grippers are configured to pivot; creating a vacuum in a body proximate to the pivot point, wherein the vacuum is configured to draw particles generated in the area of the pivot into the body; and generating a magnetic force between magnets, wherein the magnetic force drives at least one gripper toward another gripper to grasp a semiconducting substrate or a reticle between the grippers.
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