Machining apparatus and machining method
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United States of America Patent
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Jan 22, 2013
Grant Date -
May 13, 2010
app pub date -
Nov 4, 2009
filing date -
Nov 5, 2008
priority date (Note) -
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status (Latency Note)
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Abstract
The invention provides a machining apparatus, and its machining method, having machining tables whose weight do not increase so much even if a number of machining sections such as spindles is increased. One of the machining tables is a rectangular stationary table having a groove in the direction perpendicular to the longitudinal direction on its surface and the other is a rectangular movable table engaged with the groove. The machining apparatus machines a printed circuit board, whose area is larger than that of the movable table, on a mounting surface of the stationary table by changing position of the printed circuit board by moving the movable table and by determining machining position by moving a spindle at position facing the mounting surface of the stationary table.
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