Processing thin wafers

United States of America Patent

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Jan 15, 2013
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Apr 19, 2012
app pub date
Dec 20, 2011
filing date
Nov 18, 2004

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Abstract

There is described a wafer processing system for thinned wafers that are easily broken during handling. The system protects against breakage during handling and provides for temperature controls during processing.

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Patent Owner	Address
INTEVAC INC	CALIFORNIA USA

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Inventor Name	Address	# of filed Patents	Total Citations
Bluck, Terry	Santa Clara County, US	86	5256
Scollay, Stuart	Santa Clara County, US	11	120
Tong, Edric	Santa Clara County, US	31	1432

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Processing thin wafers

Number of patents in Portfolio can not be more than 2000

United States of America Patent

13332046

048635-002300

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PATENT NO	8354001
APP PUB NO	20120093616A1
SERIAL NO	13332046
DOCKET NO	048635-002300

US Family Size	Non-US Coverage
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DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
January 15, 2013	US,8354001,B2 US8354001B2	GRANTED PATENT AS SECOND PUBLICATION
April 19, 2012	US,20120093616,A1 US20120093616A1	FIRST PUBLISHED PATENT APPLICATION

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13332046

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