Integrated electronics cooling device
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United States of America Patent
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Jan 15, 2013
Grant Date -
Apr 19, 2012
app pub date -
Oct 13, 2010
filing date -
Oct 13, 2010
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Abstract
An integrated electronics cooling device including a substrate having a first surface for mounting one or more electronic components and a second surface, a cooling assembly including a cooling chamber bounded on one side by the second surface of the substrate, and a vacuum insulated coolant conduit for providing a coolant to and removing the coolant from the cooling assembly.
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