Organosilicon copolymer composites, method of manufacture, and articles formed therefrom
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United States of America Patent
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Jan 8, 2013
Grant Date -
Oct 7, 2010
app pub date -
Oct 8, 2009
filing date -
Oct 16, 2008
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Abstract
Organosilicon composites are described, comprising 30 to 90 vol. % of a cured organosilicon copolymer derived by curing an organosilicon polymer having, in the same copolymer, silicon-containing repeating units comprising a silicon hydride and silicon-containing repeating units comprising a C1-10 ethylenically unsaturated group; and 10 to 70 vol. % of a dielectric filler. The composites are used in the manufacture of circuit subassemblies.
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