Method and apparatus for laminating ultraviolet curing type waveguide material
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Jan 8, 2013
Grant Date -
Mar 12, 2009
app pub date -
Sep 4, 2008
filing date -
Sep 7, 2007
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A base plate (31) and an ultraviolet curing type waveguide material (32) are interposed between a pair of films (41, 42), a portion between the pair of films is decompressed or an external pressure is applied to the films, thereby laminating the ultraviolet curing type waveguide material on the base plate, and at the same time, ultraviolet rays are irradiated on the ultraviolet curing type waveguide material through the films to cure the waveguide material.
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
SHINKO ELECTRIC INDUSTRIES CO LTD | NAGANO-SHI NAGANO 381-2287 |
International Classification(s)
- B29C:SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTAN....
- B29D:PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FRO....
- D02J:FINISHING OR DRESSING OF FILAMENTS, YARNS, THREADS....
- B31B:MAKING BOXES, CARTONS, ENVELOPES, OR BAGS
- D02G:CRIMPING OR CURLING FIBRES, FILAMENTS, YARNS, OR T....
- B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....

Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
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Yanagisawa, Kenji | Nagano, JP | 74 | 967 |
# of filed Patents : 74 Total Citations : 967 |
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- B29C Class
- 0 % this patent is cited more than
- 12 Age
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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