Probe for testing semiconductor devices

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8344748
APP PUB NO 20120032697A1
SERIAL NO

12693428

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Abstract

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A novel hybrid probe design is presented that comprises a torsion element and a bending element. These elements allow the probe to store the displacement energy as torsion or as bending. The novel hybrid probe comprises a probe base, a torsion element, a bending element, and a probe tip. The probe elastically deforms to absorb the displacement energy as the probe tip contacts the DUT contact pad. The bending element absorbs some of the displacement energy through bending. Because the torsion element and the bending element join at an angle between −90 degrees and 90 degrees, a portion of the displacement energy is transferred to the torsion element causing it to twist (torque). The torsion element can also bend to accommodate the storage of energy through torsion and bending. Also, adjusting the position of a pivot can be manipulated to alter the energy absorption characteristics of the probe. One or more additional angular elements may be added to change the energy absorption characteristics of the probe. And, the moment of inertia for the torsion and/or bending elements can by manipulated to achieve the desired probe characteristics. Other features include a various union angle interface edge shapes, pivot cutouts and buffers.

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Patent Owner(s)

Patent OwnerAddress
FORMFACTOR INC7005 SOUTHFRONT ROAD LIVERMORE CA 94551

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hu, Ting Monrovia, US 15 36
Khoo, Melvin San Gabriel, US 9 51
Losey, Matthew Alta Loma, US 4 46

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