Epoxy resin-forming liquid preparation containing inorganic particle
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United States of America Patent
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Jan 1, 2013
Grant Date -
Jun 3, 2010
app pub date -
Jul 11, 2008
filing date -
Jul 11, 2007
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Abstract
There is provided a liquid preparation for forming an epoxy resin having curing properties combining high transparency and high bending strength while maintaining advantageous handling properties as in a liquid state. A liquid preparation for forming an epoxy resin comprising: an A agent; and a B agent; wherein the A agent contains a modified epoxy resin (I) formed from at least one type of compound (i) having in a molecule thereof, at least one functional group of Formula (1):
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