Heat-dissipating device for supplying cold airflow
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 1, 2013
Grant Date -
Aug 18, 2011
app pub date -
Feb 18, 2010
filing date -
Feb 18, 2010
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A heat-dissipating device (1) includes a casing (10) and a thermal insulation plate (20) provided within the casing (10). The thermal insulating plate (20) divides the interior of the casing (10) into a first accommodating space (101) and a second accommodating space (102). A hot air outlet (121) and a first air inlet (122) of the casing (10) are in communication with the first accommodating space (101). A cold air outlet (110) and a second air inlet (123) of the casing (10) are in communication with the second accommodating space (102). A thermoelectric cooling chip (30) is disposed in a through-hole (200) of the thermal insulation plate (20) and has a hot-end surface (31) facing the first accommodating space (101) and a cold-end surface (32) facing the second accommodating space (102). A heat-dissipating module (40) is received in the first accommodating space (101). A cold-airflow supplying module (50) is received in the second accommodating space (102). The heat generated by the hot-end surface (31) is dissipated to the hot air outlet (121) by the thermal conduction of the heat-dissipating module (40). The cold generated by the cold-end surface (32) is conducted and distributed uniformly by the cold-airflow supplying module (50) to the cold air outlet (110).
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully