Programmable vias for structured ASICs
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United States of America Patent
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Dec 25, 2012
Grant Date -
Sep 18, 2008
app pub date -
Mar 12, 2008
filing date -
Mar 13, 2007
priority date (Note) -
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Abstract
A semiconductor device may be created using multiple metal layers and a layer including programmable vias that may be used to form various patterns of interconnections among segments of metal layers. The programmable vias may be formed of materials whose resistance is changeable between a high-resistance state and a low-resistance state.
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