Copper-oxygen adduct complexes, and methods of making and use
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United States of America Patent
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Dec 25, 2012
Grant Date -
Jan 19, 2012
app pub date -
Oct 27, 2008
filing date -
Oct 26, 2007
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Abstract
The invention at hand describes Cu-(II)-oxygen adduct complexes, which are stable at room temperature, as well as methods for their production. In this, compounds of the general formula [L-Cu—O—O—Cu-L](BAr4)2 are concerned. Here, BAr4− is a tetraarylborate anion, selected from tetraphenylborate and tetrakis(3,5-trifluoromethyl)phenylborate. L represents a tripodal tetradentate ligand, wherein, each of the four binding sites of the tripodal tetradentate ligand is a nitrogen atom. Each of the three podal ligands is suitable for comprising an aliphatic amine or a nitrogen-containing heteroaromatic compound independently of one another. A bridge of one to four carbon atoms is located between the central nitrogen atom and the nitrogen atom of each of the podal ligands.
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