Thin wafer chuck
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Dec 25, 2012
Grant Date -
Jan 21, 2010
app pub date -
Jul 17, 2008
filing date -
Jul 17, 2008
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Methods and systems, in one embodiment, are described related to a chuck with a plurality of vacuum grooves on a surface. Each single vacuum groove of the plurality of vacuum grooves has a single port connected with a single vacuum line coupled to a vacuum source. The single vacuum line is not shared with another groove and a restriction is applied to the single vacuum line in order to isolate each single vacuum groove.
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