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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
DOW CORNING CORPORATION	2200 WEST SALZBURG RD P O BOX 994 PATENT DEPARTMENT CO1232 MIDLAND MI 48686-0994

International Classification(s)

• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Bhagwagar, Dorab	Saginaw, US	23	135
Elahee, G M Fazley	Midland, US	6	83
Liles, Donald	Midland, US	13	152
Lin, Zuchen	Midland, US	30	575
Shephard, Nick	Midland, US	10	102
Xu, Shengqing	Midland, US	17	414

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
December 18, 2012	US,8334592,B2   US8334592B2	GRANTED PATENT AS SECOND PUBLICATION
August 19, 2010	US,20100208432,A1   US20100208432A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 8334592

Thermal interface material, electronic device containing the thermal interface material, and methods for their preparation and use

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