Inkjet printhead intergrated configured to minimize thermal losses
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United States of America Patent
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Dec 11, 2012
Grant Date -
Jul 8, 2010
app pub date -
Mar 22, 2010
filing date -
Apr 4, 2005
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Provided is an inkjet printhead integrated circuit that has a wafer substrate that has an ink passage, and a nozzle plate supported on the substrate by side walls to define an ink chamber supplied with ink via the ink passage. The nozzle plate has an ink ejection port corresponding to the ink chamber. A heater element is bonded to the nozzle plate inside the chamber for vaporising ink to generate a vapor bubble that ejects ink through the ejection port. The heater element is bonded to the nozzle plate with a low thermal product layer. The thermal product thermal product is less than 1495 Jm−2K−1s−1/2, the thermal product being (ρCk)1/2, where ρ is the density of the layer, C is specific heat of the layer and k is thermal conductivity of the layer.
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