Transfer device for receiving and transferring a solder ball arrangement

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8328068
APP PUB NO 20100213243A1
SERIAL NO

12663329

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention relates to a transfer device (10) for receiving and transferring a solder ball arrangement (28). Said transfer device comprises a discharge container (11) and a transfer substrate (12) that interacts with the discharge container in order to obtain a flat solder ball arrangement and that can be subjected to a negative pressure. The discharge container comprises an at least partially perforated base wall (14) and the transfer substrate has a hole pattern for receiving the solder ball arrangement. The discharge container comprises an ultrasound device (37) for subjecting said discharge container to ultrasound vibrations.

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Patent Owner(s)

Patent OwnerAddress
PAC TECH - PACKAGING TECHNOLOGIES GMBH14641 NAUEN

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Azdasht, Ghassem Berlin, DE 59 605
Tabrizi, Siavash Berlin, DE 2 7

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  • 4 Citation Count
  • B23K Class
  • 6.96 % this patent is cited more than
  • 13 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges484021424824792421101 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +0255075100125150175200225250275300325350375400425

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