Increasing thermal isolation of a probe card assembly
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United States of America Patent
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Dec 4, 2012
Grant Date -
Sep 17, 2009
app pub date -
Nov 21, 2008
filing date -
Mar 13, 2008
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A probe card assembly can include an electrical interface to a test system for testing electronic devices such as semiconductor dies. The probe card assembly can also include probes located at a first side of the probe card assembly. The probes, which can be electrically connected to the electrical interface, can be configured to contact terminals of the electronic devices in the test system while the probe card assembly is attached to the test system. The probe card assembly can be configured to impede thermal flow from the probe card assembly to the test system at places of physical contact between the probe card assembly and the test system while the probe card assembly is attached to the test system.
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