Stacked die module
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United States of America Patent
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-
Dec 4, 2012
Grant Date -
Apr 13, 2006
app pub date -
Jun 24, 2005
filing date -
Sep 27, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Semiconductor dies are stacked offset from one another so that terminals located along two edges of each die are exposed. The two edges of the dies having terminals may be oriented in the same direction. Electrical connections may connect terminals on one die with terminals on another die, and the stack may be disposed on a wiring substrate to which the terminals of the dies may be electrically connected.
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