Method of manufacturing color printed circuit board
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 4, 2012
Grant Date -
Jan 6, 2011
app pub date -
May 27, 2010
filing date -
Jul 6, 2009
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Disclosed herein is a method of manufacturing a color printed circuit board. The method includes non-consecutively printing a conductive ink on a flexible insulation board in a piezoelectric inkjet manner to form an electrically conductive pattern, applying an electrically conductive bonding agent to a light emitting chip mounting portion of the electrically conductive pattern for mounting a light emitting chip, forming a waterproof layer on an overall surface of a resultant after mounting the light emitting chip on the light emitting chip mounting portion of the electrically conductive pattern to which the electrically conductive bonding agent is applied, and forming a color pattern on an overall surface of the light emitting diode using a color ink.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully