Piezofan and heat sink system for enhanced heat transfer
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United States of America Patent
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Dec 4, 2012
Grant Date -
Mar 13, 2008
app pub date -
Sep 12, 2006
filing date -
Sep 12, 2006
priority date (Note) -
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Abstract
An electronic device having enhanced heat dissipation capabilities includes an electronic device, a heat sink, a channel, a piezoelectric element, and a blade. The heat sink is in thermal communication with the electronic device. The channel includes an inlet, an outlet and a constriction disposed along the channel between the inlet and the outlet. The heat sink defines at least a portion of the channel. The blade includes a free end and an attached end. The blade is disposed in the channel and connected to the piezoelectric element. The piezoelectric element is activated to move the blade side to side in the channel to create air vortices. The constriction in the channel and the blade cooperate with one another such that a vortex that is generated as the blade moves toward a first side of the channel is compressed against the first side of the channel and expelled towards the outlet of the channel.
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