Laser machining method and laser machining apparatus
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United States of America Patent
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Nov 27, 2012
Grant Date -
Apr 5, 2007
app pub date -
Sep 22, 2006
filing date -
Sep 30, 2005
priority date (Note) -
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Abstract
There is provided a laser machining method and a laser machining apparatus whose machining accuracy and quality excel without lowering machining efficiency. One hole is machined by a split beam that is a first pulsed laser beam and another split beam that is a second pulsed laser beam whose irradiation position is determined based on irradiation position of the first laser beam. In this case, the machining quality may be improved by machining the circular hole by equalizing circling directions and angular velocity of the split beams. A beam splitter splits a laser beam outputted out of one laser oscillator into the split beams and AOMs can time-share them.
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