Manufacturing method of semiconductor device including Au bump on seed film
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United States of America Patent
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Nov 27, 2012
Grant Date -
Dec 30, 2010
app pub date -
May 28, 2010
filing date -
Jun 30, 2009
priority date (Note) -
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Abstract
The manufacturing method includes: forming a seed film on a semiconductor chip; forming a photoresist having an opening above an electrode of the semiconductor chip on the seed film; forming a first Au bump on the seed film in the opening by electrolytic plating with a current density of 1.5 A/dm2 or above; grinding a surface of the first Au bump; stripping the photoresist; and removing the seed film by dry-etching.
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