Integration manufacturing process for MEMS device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 27, 2012
Grant Date -
May 10, 2012
app pub date -
Jan 4, 2012
filing date -
Jun 18, 2004
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method for manufacturing an MEMS device is provided. The method includes steps of a) providing a first substrate having a concavity located thereon, b) providing a second substrate having a connecting area and an actuating area respectively located thereon, c) forming plural microstructures in the actuating area, d) mounting a conducting element in the connecting area and the actuating area, e) forming an insulating layer on the conducting element and f) connecting the first substrate to the connecting area to form the MEMS device. The concavity contains the plural microstructures.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully