Integrated circuit packaging system with embedded conductive structure and method of manufacture thereof
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United States of America Patent
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Nov 13, 2012
Grant Date -
Sep 27, 2012
app pub date -
Mar 23, 2011
filing date -
Mar 23, 2011
priority date (Note) -
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a package carrier; mounting an integrated circuit device to the package carrier; mounting an embeddable conductive structure, having a non-horizontal portion between a lower portion and an elevated portion and a hole, to the integrated circuit device with the lower portion over the integrated circuit device; mounting an interposer to the lower portion and below the elevated portion; and forming an encapsulation having a recess exposing the interposer and the elevated portion.
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