Polyamide moulding compound and use thereof
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United States of America Patent
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Nov 13, 2012
Grant Date -
Nov 25, 2010
app pub date -
Aug 4, 2010
filing date -
Jul 11, 2006
priority date (Note) -
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Abstract
The present invention relates to polyamide moulding compounds which have very low distortion with good mechanical properties. This is achieved by a combination of transparent polyamide with fibrous reinforcing materials and also particulate fillers. The moulding compounds according to the invention are used for the production of any moulded articles, semi-finished products or finished products.
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