Multi material secondary metallization scheme in MEMS fabrication
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United States of America Patent
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Nov 13, 2012
Grant Date -
May 5, 2011
app pub date -
Oct 29, 2009
filing date -
Oct 29, 2009
priority date (Note) -
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Abstract
Processes are provided herein for the fabrication of MEMS utilizing both a primary metal that is integrated into the final MEMS structure and two or more sacrificial secondary metals that provide structural support for the primary metal component during machining. A first secondary metal is thinly plated around the primary metal and over the entire surface of the substrate without using photolithography. A second secondary metal, is then thickly plated over the deposited first secondary metal without using photolithography. Additionally, techniques are disclosed to increase the deposition rate of the first secondary metal between primary metal features in order to prevent voiding and thus enhance structural support of the primary metal during machining.
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