Systems and methods for magnetron deposition
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United States of America Patent
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Nov 13, 2012
Grant Date -
Mar 20, 2008
app pub date -
Sep 14, 2006
filing date -
Sep 14, 2006
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Abstract
Systems and methods are disclosed for face target sputtering to fabricate semiconductors by providing one or more materials with differential coefficients of expansion in the FTS chamber; and generating a controlled pressure and size with the one or more materials during sintering.
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