Di-cinnamyl compounds and methods for use thereof
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United States of America Patent
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Nov 13, 2012
Grant Date -
Nov 26, 2009
app pub date -
Apr 9, 2009
filing date -
Apr 9, 2008
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Abstract
The invention generally relates to di-cinnamyl compounds useful in a variety of adhesive applications. More specifically, the invention provides chain-extended bismaleimides and methods for generating them by reaction with di-cinnamyl compounds, including particular di-cinnamyl compounds disclosed herein. Invention di-cinnamyl compounds can also be used as co-monomers in a Diels-Alder type cure, and can act as a co-monomer in a thermoset composition with a maleimide monomer.
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