System and method to form and heat-treat a metal part
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United States of America Patent
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Nov 13, 2012
Grant Date -
Jan 13, 2011
app pub date -
Jul 7, 2009
filing date -
Jul 7, 2009
priority date (Note) -
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Abstract
A system and method for direct manufacturing and stress relieving a metal part without removing the metal part from a vacuumed chamber. The system may comprise the chamber, a wire feeder for depositing a metal wire onto a metal plate, an electron beam (EB) source for providing an electron beam to melt the metal wire during deposition, and a current-providing apparatus for joule heating the metal plate to provide heat treatment to the metal part. The method may comprise depositing the metal wire onto the metal plate within the vacuumed chamber, then providing intermediate stress relief after a portion of the metal wire is deposited onto the metal plate by applying an electrical current to the metal part. The electron beam may also be set at a temperature below a melting point of a particular metal of the metal part for relieving stress in the metal part.
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