Electrodeposited copper foil with carrier foil with a primer resin layer and manufacturing method thereof
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United States of America Patent
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Nov 6, 2012
Grant Date -
May 8, 2008
app pub date -
Sep 9, 2005
filing date -
Sep 10, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Present invention provides an electrodeposited copper foil with carrier foil that assure high bonding strength between a surface of the bulk copper layer and a resin substrate layer even when surface roughness is low, and hardly occurs delamination even when pin holes and the like remain in a bulk copper layer or in the side wall of the through holes or via holes and the like after contact with a desmear solution and the like. To solve such a problem, electrodeposited copper foil with carrier foil with a primer resin layer comprising a bonding interface layer, a bulk copper layer, a plated Ni—Zn alloy layer and a primer resin layer which is formed in this order at least on one surface of the carrier foil is applied.
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