Highly thermally-conductive moldable thermoplastic composites and compositions
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United States of America Patent
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Oct 30, 2012
Grant Date -
Feb 17, 2011
app pub date -
May 4, 2010
filing date -
Aug 17, 2009
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Abstract
Thermally-conductive moldable thermoplastic compositions or composites may generally include a plurality of metal-coated filler particles; a plurality of secondary filler particles; and a polymer matrix in admixture with the metal-coated filler particles and the secondary filler particles. The composition or composite may have a thermal conductivity ranging from about 20 Watts per meter-Kelvin to about 35 Watts per meter-Kelvin. Injection molded articles having a moldable thermally-conductive thermoplastic composition or composite can be formed for microelectronics, automotive, avionic, and other heat dissipation applications.
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