Dual CPU and heat dissipating structure thereof

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United States of America Patent

PATENT NO 8295050
APP PUB NO 20120113587A1
SERIAL NO

12940611

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Abstract

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A dual CPU and its heat dissipating structure are applied to a heat dissipating module installed on a dual-CPU computer device, and CPUs are arranged alternately with each other on a motherboard, and the heat dissipating modules are installed at positions of the CPUs, such that the alternately arranged heat dissipating modules can prevent interferences by external cold air, and a heat source produced by the CPUs can be conducted and dissipated to the outside to prevent the heat source form remaining at the surrounding of the CPUs and related components installed on the motherboard to achieve an excellent heat dissipating efficiency.

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Patent Owner(s)

Patent OwnerAddress
PORTWELL INCSHULIN CITY 23845 TAIPEI COUNTY

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Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2010201120122013201420152016201720182019202020210255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheng, Chia-Ming Shulin, TW 76 317
Chuang, Hui-Hsuan Shulin, TW 1 2

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  • 1 Citation Count
  • H05K Class
  • 2.26 % this patent is cited more than
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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges244252631486938401391061701 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +0255075100125150175200225250275300325350375400425450

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