Dual CPU and heat dissipating structure thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 23, 2012
Grant Date -
May 10, 2012
app pub date -
Nov 5, 2010
filing date -
Nov 5, 2010
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A dual CPU and its heat dissipating structure are applied to a heat dissipating module installed on a dual-CPU computer device, and CPUs are arranged alternately with each other on a motherboard, and the heat dissipating modules are installed at positions of the CPUs, such that the alternately arranged heat dissipating modules can prevent interferences by external cold air, and a heat source produced by the CPUs can be conducted and dissipated to the outside to prevent the heat source form remaining at the surrounding of the CPUs and related components installed on the motherboard to achieve an excellent heat dissipating efficiency.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully