Semiconductor device having an enlarged emitter electrode

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United States of America Patent

PATENT NO 8294244
APP PUB NO 20110049562A1
SERIAL NO

12721827

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A semiconductor device comprises: a semiconductor substrate; a plurality of IGBT cells on the semiconductor substrate, each of the IGBT cells including a gate electrode and a first emitter electrode; a first gate wiring on the substrate and being connected to the gate electrode; an interlayer insulating film covering the first emitter electrode and the first gate wiring; and a second emitter electrode on the interlayer insulating film and being connected to the first emitter electrode through an opening of the interlayer insulating film, wherein the second emitter electrode extends above the first gate wiring via the interlayer insulating film.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI ELECTRIC CORPORATION7-3 MARUNOUCHI 2-CHOME CHIYODA-KU TOKYO 100-8310

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Suzuki, Kenji Tokyo, JP 1029 11556
Tomomatsu, Yoshifumi Tokyo, JP 31 427

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