Wafer-scale array of optical packages and method for fabricating the same

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United States of America Patent

PATENT NO 8294229
APP PUB NO 20100283113A1
SERIAL NO

12812357

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Abstract

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A wafer-scale array of optical packages and a method for fabricating the same. The wafer-scale array of optical packages includes at least one wafer-scale array of lens structures, including a wafer-scale array of first barrel structures and a wafer-scale array of lenses directly formed on the wafer-scale array of first barrel structures such that the wafer-scale array of lenses is integrally combined with the wafer-scale array of first barrel structures, the wafer-scale array of first barrel structures being made of a material different from a material of the lens of the wafer-scale array of lenses; and at least one wafer-scale array of second barrel structures stacked on and combined with the at least one wafer-scale array of lens structures.

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Patent Owner(s)

Patent OwnerAddress
INDUSTRY-ACADEMIC CO-OPERATION FOUNDATION YONSEI UNIVERSITYYONSEI UNIVERSITY 134 SINCHON-DONG SEODAEMUN-GU SEOUL 120-749

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Choi, Min Seok Pusan, KR 31 244
Kang, Shinill Seoul, KR 19 124
Kim, Ho Kwan Seoul, KR 1 15
Lim, Ji Seok Gyeonggi-do, KR 2 33

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