Resin composition for stereolithography
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United States of America Patent
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Oct 23, 2012
Grant Date -
Aug 20, 2009
app pub date -
Jun 15, 2007
filing date -
Jun 16, 2006
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Abstract
Provided is a resin composition for stereolithography that absorbs little water and moisture over time in uncured state, maintains a low moisture absorption rate even under high humidity, and has high curing sensitivity, from which a stereolithography product excellent in the properties, such as dimensional accuracy, mechanical properties, and dimensional stability can be smoothly produced for reduced light irradiation time. The resin composition for stereolithography comprising an oxetane compound expressed by the general formula (I) below:
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