Ruggedized computer and aspects thereof
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United States of America Patent
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Oct 16, 2012
Grant Date -
Jan 12, 2012
app pub date -
Jul 12, 2010
filing date -
Jan 4, 2008
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A mechanical and thermal assembly adapted to absorb heat from a delicate, heat-producing structure having a planar surface includes a slide plate in thermal contact to said planar surface, and being held in place by a resilient system that permits, but gently resists, movement perpendicular to said planar surface and a thermal mass, suspended over said slide plate, but in thermal contact to said slide plate, so that said delicate, heat-producing structure is not damaged due to force applied from said thermal mass through said slide plate to said structure.
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