Anti-tamper microchip package based on thermal nanofluids or fluids
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United States of America Patent
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Oct 16, 2012
Grant Date -
Mar 22, 2012
app pub date -
Sep 17, 2010
filing date -
Sep 17, 2010
priority date (Note) -
Expired
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Abstract
A tamper-resistant microchip package contains fluid- or nanofluid-filled capsules, channels, or reservoirs, wherein the fluids, either alone or in combination, can destroy circuitry by etching, sintering, or thermally destructing when reverse engineering of the device is attempted. The fluids are released when the fluid-filled cavities are cut away for detailed inspection of the microchip. Nanofluids may be used for the sintering process, and also to increase the thermal conductivity of the fluid for die thermal management. Through-vias and micro vias may be incorporated into the design to increase circuitry destruction efficacy by improving fluid/chip contact. Thermal interface materials may also be utilized to facilitate chip cooling.
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