Ballistic-resistant panel including high modulus ultra high molecular weight polyethylene tape
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United States of America Patent
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Oct 16, 2012
Grant Date -
Oct 25, 2012
app pub date -
Jun 15, 2011
filing date -
Apr 13, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
A ballistic-resistant panel in which the entire panel or a strike-face portion thereof is formed of a plurality of sheets of high modulus high molecular weight polyethylene tape. The sheets of high modulus polyethylene tape can be in the form of cross-plied laminated layers of tape strips or a woven fabric of tape strips. The strips of UHMWPE tape include a width of at least one inch and a modulus of greater than 1400 grams per denier. The ballistic-resistant panel may include a backing layer of conventional high modulus fibers embedded in resin. A wide variety of adhesives were found acceptable for bonding the cross-plied layers of high modulus polyethylene tape together for forming the ballistic-resistant panels of the present invention.
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