Method for improving mechanical strength of bondings made with an adhesive based on curable resin by chain polymerization
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United States of America Patent
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Oct 9, 2012
Grant Date -
May 28, 2009
app pub date -
May 10, 2007
filing date -
May 11, 2006
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The invention relates to a process that makes it possible to improve the mechanical strength of bonds between substrates when these bonds are produced by means of an adhesive that comprises a resin that can be cured by chain polymerization, and in particular a resin that can be cured under the effect of ionizing or light radiation.
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