Method for simultaneously cutting a compound rod of semiconductor material into a multiplicity of wafers
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United States of America Patent
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Oct 9, 2012
Grant Date -
Apr 15, 2010
app pub date -
Oct 14, 2009
filing date -
Oct 15, 2008
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Abstract
A method for simultaneously cutting a compound rod of semiconductor material into a multiplicity of wafers. The method includes selecting a first workpiece and a second workpiece, each having two end surfaces; grinding at least one of the two end surfaces of each workpiece so as to create a ground end surface on each workpiece; cementing the ground end surface of the first workpiece to the ground end surface of second workpiece using a fastener so as to produce a compound rod piece having a longitudinal axis, wherein the fastener is disposed between the workpieces so as create a distance between the workpieces; fixing the compound rod piece in a longitudinal direction on a mounting plate; clamping the mounting plate with the compound rod piece in a wire saw; and cutting the compound rod piece perpendicularly to the longitudinal axis using the wire saw.
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