Element substrate, recording head using the element substrate, and recording apparatus
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United States of America Patent
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Oct 9, 2012
Grant Date -
Feb 14, 2008
app pub date -
Aug 6, 2007
filing date -
Jan 23, 2004
priority date (Note) -
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Abstract
A buffer circuit for shaping a waveform of a logic signal is arranged where a line for a logic circuit included in a recording-head substrate is divided into substantially equal portions, the line having an unignorable parasitic component due to its increased length. Therefore, the recording-head substrate, a recording head using the recording-head substrate, and a recording apparatus including the recording head are capable of minimizing the adverse effects of parasitic resistance and parasitic capacitance in lines even when the length of a heater array is increased.
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